Silver reduced NiGe electronic solders

ISO-Tin Sn100Ni+®, ISO-Tin Sn99Ag+®, ISO-Tin Sn98Ag+®

Since the RoHs regulations came into force SAC solders with an Ag-percentage of between 3 and 4% have displaced SnPb solders as standard solders in electronic production.

The constantly increasing silver quotation caused a search for alternatives. The effects of a reduction in Ag-percentage within the electronic solders have been analysed by various research boards.

Solders with a silver amount at around 0.3 and 1% respectively are called "Second generation lead-free solders" by now.

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FELDER ISO-Cream® "EL 5510"

LEAD-FREE, Sn96Ag+

The solder paste ISO-Cream ® "EL 5510" – LEAD-FREE is a homogenous, ready-made odourless mixture of metal powder, bonding agents, solvents, fluxes and thixotropic agents.

ISO-Cream "EL 5510" – LEAD-FREE possesses all positive properties of nickel and germanium endowment like e. g. the refinement of the alloy structural condition and increase of the crack strain.

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