Silver reduced NiGe electronic solders
ISO-Tin Sn100Ni+®, ISO-Tin Sn99Ag+®, ISO-Tin Sn98Ag+®
Since the RoHs regulations came into force SAC solders with an
Ag-percentage of between 3 and 4% have displaced SnPb solders as
standard solders in electronic production.
The constantly
increasing silver quotation caused a search for alternatives. The
effects of a reduction in Ag-percentage within the electronic solders
have been analysed by various research boards.
Solders with a silver amount at around 0.3 and 1% respectively are called "Second generation lead-free solders" by now.
FELDER ISO-Cream® "EL 5510"
LEAD-FREE, Sn96Ag+
The solder paste ISO-Cream ® "EL 5510" – LEAD-FREE is a homogenous, ready-made odourless mixture of metal powder, bonding agents, solvents, fluxes and thixotropic agents.
ISO-Cream "EL 5510" – LEAD-FREE
possesses all positive properties of nickel and germanium endowment
like e. g. the refinement of the alloy structural condition and increase
of the crack strain.


