Electronic fluxes ISO-Flux®
Fluxes for the mechanical soldering of printed circuit boards
| PU | Delivery form |
| 1 l | bottle |
| 5 l | canister |
| 25 l | canister |
| Other packages deliverable on request | |
| Product | DIN EN 29454 | DIN EN 61190 | Solid Content | Field of application |
| ELR 3410 | 2.2.3.A | ORL0 | 3,5 % | wave soldering, halide free, no-clean, also lead free |
| ELR 3420 | 2.2.3.A | ORL0 | 3,5 % | wave soldering, halide free, no-clean, also lead free |
| ELR 3413 | 2.2.3.A | ORL0 | 2,1 % | wave soldering, halide free, no-clean |
| ELS 3320 | 2.2.3.A | ORL0 | 2,7 % | wave soldering, halide free, resin free, no-clean, also lead free |
| ELS 3320-22 | 2.2.3.A | ORL0 | 2,2 % | wave soldering, halide free, resin free, no-clean, also lead free |
| ELI 0099 | 2.1.3.A | ORL0 | < 1 % | wave soldering, no-clean, in inert gas systems, also lead free |
| EWL 2510 | 2.1.2.A | ORM1 | 7,0 % | wave soldering, halide containing, water washable, also lead free |
| EVF 2310 | 2.1.3.A | ORL0 | 3,8 % | wave soldering, halide free, lead free, no-clean, VOC-free |
| Palux 30H | - | - | - | HASL-tinning |
For soldering of electronic components with THD and SMD by machine.
For soldering of electronic components with THD and SMD by machine. FELDER ISO-Flux® electronic fluxes are particularly suitable for high-grade manufacturing of commercial electronic. You achieve best soldering results even in case of circuits with mixed component parts.
"ELR"
low-residue no-clean electronic flux based on organic activators and natural or modified natural resins. The flux residues have a very high surface resistance and are not corrosive.
"ELI" / "ELS"
resin-free no-clean electronic flux on basis of organic activators. Our "ELI 0099" has been specifically designed for soldering in inert gas systems and leaves a very low amount of flux residues due to its low amount of solids.
"EWL"
highly effective, water-soluble electronic flux, contains and activated by halide, so that it can be applied wherever components have to be washed after the soldering process.
Go back


