Product information

We produce the complete range of lead-free electronic solders of 0 < up to ≤ 4,0 % pure silver content according Fuji-Patent DE 198 16 671.


ISO-Tin Sn100Ni+®
ISO-Tin Sn99Ag+®
ISO-Tin Sn98Ag+®
ISO-Tin Sn96Ag+®
ISO-Tin Sn95Ag+®

are patented and optimized developments of conventional Sn99,3Cu0,7Ni-Allos with the well-known properties:

Ni as barrier layer for   

    * prevention of whisker-development
    * increase of the creep strength of the soldering by reduction of growth in the IM-phase
    * prevention of dealloying appearances at the pot and nozzle parts of older solderingunits with VA-pots and soldering iron tip
    * reduction of   Cu-leachings

Shiny solderings joints (not unfamiliar according the look of lead-containing soldering joints)

Homogenous characteristic of the metal structure of the soldering joint and therefore optimal solidification attitude without shrinking cracks (micro cracks).

ISO-Tin Sn100Ni+® - considerable price advantage (ca. 30 %) for SAC 305 - alloy
ISO-Tin Sn99Ag+® - considerable price advantage (ca. 30 %) for SAC 305 - alloy
ISO-Tin Sn98Ag+® - considerable price advantage (ca. 15 %) for SAC 305 - alloy