ISO-Tin Sn100Ni+, Sn99Ag+, Sn98Ag+, Sn96Ag+, Sn95Ag+
We produce the complete range of lead-free electronic solders of 0 < up to ≤ 4,0 % pure silver content according Fuji-Patent DE 198 16 671.
are patented and optimized developments of conventional Sn99,3Cu0,7Ni-Allos with the well-known properties:
Ni as barrier layer for
* prevention of whisker-development
* increase of the creep strength of the soldering by reduction of growth in the IM-phase
* prevention of dealloying appearances at the pot and nozzle parts of older solderingunits with VA-pots and soldering iron tip
* reduction of Cu-leachings
Shiny solderings joints (not unfamiliar according the look of lead-containing soldering joints)
Homogenous characteristic of the metal structure of the soldering joint and therefore optimal solidification attitude without shrinking cracks (micro cracks).
ISO-Tin Sn100Ni+® - considerable price advantage (ca. 30 %) for SAC 305 - alloy
ISO-Tin Sn99Ag+® - considerable price advantage (ca. 30 %) for SAC 305 - alloy
ISO-Tin Sn98Ag+® - considerable price advantage (ca. 15 %) for SAC 305 - alloy