No-clean SMD soft solder pastes
according to DIN EN 29454.1, 1.1.3.C, respectively DIN EN 61190-1-3, ROL1
Homogenous, ready-made and odourless mixture of metal powder, binding agents, solvents, fluxes and thixotropic additives.
Flux according to DIN EN 29454.1, 1.1.3.C, respectively DIN EN 61190-1-3, ROL1
ISO-Cream® "EL 5510" Non halogen, no-clean solder paste for an excellent wetting ability on all known surfaces , optimal printability, very high surface resistance , good for very small pad gaps ,fine alloy structure ( NiGe-Alloy ) , very strong wet bonding (min. 48 hours) - DIN EN 61190-1-3, ROL0.
ISO-Cream® "EL 3201" For all applications particularly for dispensing. Metal powder content 85 - 90 %. Excellent soldering results with minimum flux residues.
ISO-Cream® "EL 3202" Especially for vapour phase soldering and stencil printing. Minimum water clear residues. Processing time range for at least 24 h.
ISO-Cream® "EL 3203" Excellent tack force for assembly machines with high acceleration respectively deceleration. Printed boards up to 32 hrs. High outline stability. Long stencil and tack life up to 8 h.
ISO-Cream® “Delta 5“ Highest wetting with lead-free applications. Reduction of peak-temperature for ca. 20°C. Reduction of the ΔT / PCB of up to 5 K. Long working period of at least 48 hours. Suitable for reflow and vapour phase.
| Deliveryform | Content |
| Jars | 0,25 and 0,50 kg |
| Cartridges | 6 und 12 oz Semco® |
| Cartridges | ProFlow™ and PuckPack™ |
| Dispensing cartridges | 5, 10 and 30 ccm |
| Lead free alloys | |
| Sn96Ag+® Sn96,5Ag3Cu0,5NiGe | 217 - 219 °C |
| Sn95,5Ag4Cu0,5 | 217 °C eutectic |
| Sn96,5Ag3,5 | 221 °C eutectic |
| Sn99,3Cu0,7 | 227 °C eutectic |
| Bi58Sn42 | 138 °C eutectic |
| Metal powder content | |
| Dispensing | 85 - 88 % |
| Screen printing | 88 % |
| Stencil printing | 88 - 90 % |
| Lead containing alloys | |
| Sn62Pb36Ag2 | 179 °C eutectic |
| Sn63Pb37 | 183 °C eutectic |
| Sn62Pb37,4Ag0,4Sb0,2* | 183 - 186 °C |
| Pb93Sn5Ag2 | 296 - 301 °C |
*Anti-tombstoning alloy
| Grain sizes | ||
| KG 2 | Standard | 45 - 75 µm |
| KG 3 | Fine-Pitch | 25 - 45 µm |
| - | DELTA 5 | 25 - 38 µm |
| KG 4 | Superfine-Pitch | 20 - 38 µm |
| KG 5 | Superfine-Pitch | 15 - 25 µm |
High flexibility taking customer specifications into account.
All ISO-Cream® - SMD solder pastes can be set based on customer request to viscosity ranges between 300 and 900 Pa s (acc. to Brookfield, 5 U/min, TF-spindle, 25 °C). Modern test and control procedures based on national and international standards ensure a 100% continual, batch-spanning quality.
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