Flux-cored soft solder wire ISO-Core® "RA"
acc. to DIN EN 29454.1, 1.1.2.B, or DIN EN 61190-1-3, ROM1
Standard solder wire for manual soldering in electrical engineering, standard flux content 2.5 %.
| Article No. (Nos. 1- 4) |
Alloy | DIN EN 29453 | DIN EN 61190 | Melting range | Melting range |
| 1884 . . . . | Sn95,5Ag3,8Cu0,7 | - | Sn96Ag04Cu0,7 | 217 °C eutectic | lead-free |
| 1895 . . . . | Sn97Ag3 | S-Sn97Ag3 | - | 221 - 224 °C | |
| 1894 . . . . | Sn99,3Cu0,7 | S-Sn99Cu1 | Sn99Cu.7 | 227 °C eutectic | |
| 1897 . . . . | Sn97Cu3 | S-Sn97Cu3 | - | 230 - 250 °C | |
| 551894 . . . . | Sn100Ni+ | Fuji Patent | - | 227 °C eutectic | |
| 1860 . . . . | Sn60Pb40 | S-Sn60Pb40 | Sn60Pb40 | 183 - 190 °C | lead-containing |
| 1864 . . . . | Sn60Pb38Cu2 | S-Sn60Pb38Cu2 | Sn60Pb38Cu02 | 183 - 190 °C | |
| 1853 . . . . | Pb50Sn50 | S-Pb50Sn50 | Sn50Pb50 | 183 - 215 °C | |
| 1840 . . . . | Pb60Sn40 | S-Pb60Sn40 | Sn40Pb60 | 183 - 235 °C | |
| 1832 . . . . | Pb70Sn30 | S-Pb70Sn30 | Sn30Pb70 | 183 - 255 °C | |
| Other alloys, sizes and delivery forms are available upon request. | |||||
Diameters
| Article No. (Nos 5+6) | Ø in mm |
| 18 . . 05 . . | 0,50 |
| 18 . . 07 . . | 0,75 |
| 18 . . 10 . . | 1,00 |
| 18 . . 15 . . | 1,50 |
| 18 . . 20 . . | 2,00 |
| 18 . . 30 . . | 3,00 |
| 18 . . 40 . . | 4,00 |
Spools
| Article No. (Nos 7+8) | Size |
| 18 . . . . 10 | 0,10 kg |
| 18 . . . . 20 | 0,25 kg |
| 18 . . . . 30 | 0,50 kg |
| 18 . . . . 40 | 1,00 kg |
| 18 . . . . 50 | 5,00 kg |
Example for the article number: "18601040"
| Nos 1+2 | Nos 3+4 | Nos 5+6 | Nos 7+8 |
| 18 | 60 | 10 | 40 |
| ISO-Core® "RA" | Sn60Pb40 | Ø = 1,00mm | 1,00 kg |
For fine soldering in electronics, electrical engineering, telecommunications and electric motor construction.
FELDER ISO-Core® solder wires are produced similar to FELDER ISO-Tin® electronic grade solder alloys using the same high-purity alloy components according to international standards. The fluxing agents are characterised by their high thermal stability and the fact that they do not spatter during reflow! The light, solid flux residue of these solder wires does not cause corrosion with nonferrous metals. As a result, this residue does not have to be removed at the soldered joint.
Other available, halide activated solder wires according to DIN EN 29454.1, 1.1.2.B:
ISO-Core® "RA-05"
Mildly halide activated, also suitable for electronics to a certain extent, halogen content < 0.5%.
ISO-Core® "RA-AT"
Specifically developed for mechanical soldering with short cycles and high soldering temperatures, halogen content < 1.5%.
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