Flux-cored, halide-free solder wire ISO-Core® "EL"
acc. to DIN EN 29454.1, 1.1.3.B or DIN EN 61190-1-3, ROL0 resp.
No-clean standard solder wire for manual soldering in electronics, standard flux content 3.5%
| Article-No. (No.s 1- 4) | Alloy | DIN EN 29453 | DIN EN 61190 | Melting range | lead-free/ -containing |
| 2084 . . . . | Sn95,5Ag3,8Cu0,7 | - | Sn96Ag04Cu0,7 | 217 °C eutectic | lead-free |
| 2095 . . . . | Sn97Ag3 | S-Sn97Ag3 | - | 221 - 224 °C | |
| 2094 . . . . | Sn99,3Cu0,7 | S-Sn99Cu1 | Sn99Cu.7 | 227 °C eutectic | |
| 2097 . . . . | Sn97Cu3 | S-Sn97Cu3 | - | 230 - 250 °C | |
| 552094 . . . . | Sn100Ni+ | Fuji Patent | - | 227 °C eutectic | |
| 2060 . . . . | Sn60Pb40 | S-Sn60Pb40 | Sn60Pb40 | 183 - 190 °C | lead-containing |
| 2064 . . . . | Sn60Pb38Cu2 | S-Sn60Pb38Cu2 | Sn60Pb38Cu02 | 183 - 190 °C | |
| 2040 . . . . | Pb60Sn40 | S-Pb60Sn40 | Sn40Pb60 | 183 - 235 °C | |
| Other alloys, sizes and delivery forms are available upon request. | |||||
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