Fitting solder paste Cu-Rofix®4-Spezial
DIN EN 29453, S-Sn97Ag3, DIN EN 29454.1, 3.1.1.C
for soft soldering of copper piping in drinking water and heating installations acc. to DVGW-Arbeitsblatt GW 7, awarded the RAL mark of quality of Gütegemeinschaft Kupferrohr e.V. Metal content at least 60%. The flux residue is soluble in cold water and can be easily removed by rinsing.
| Article-No. | Delivery form | PU | Alloy | Melting range |
| 229560501 | 0,100 kg jar with brush clip and holder | 100 pcs. | S-Sn97Ag3 | 221 - 240 °C |
| 229560551 | 0,250 kg jar with brush clip and holder | 50 pcs. |
The specific advantages
• The solder powder component does not settle, meaning stirring the solder paste is not necessary.
• The excellent gap filling properties contribute to optimisation of the shearing resistance.
• Due to the large effective area, the overheating limit is correspondingly high. In addition, melting
of the solder component announces achievement of working temperature.
• The high holding time of the solder paste allows optimal processing even days after application.
• Flux residue is up to 100% soluble in cold water and can be removed easily with rinsing.
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