The new SMD solder paste guarantees very good flow and wetting properties.
Introduced at the “SMT 2015” and already appreciated by all customers:
The new solder paste ISO-Cream “Clear” is characterised by its excellent wetting properties on all surfaces. Even with low solder paste application of only 16 % of the pad area a 100 % wetting of the solder surface is reached after the reflow-process. ISO-Cream “Clear” is free of any thixotropic agents. Therefore, a steady viscosity and a very good contour stability are guaranteed at any time. Thus optimal printing results can be reached at any time, also after 200 prints or after printing breaks of 8 hours.
The bright, crystal clear flux residues guarantee an error-free inspection with AOI controlling systems.