SMD soft solder paste ISO-Cream "Clear"


The lead-free SMD-solder paste ISO-Cream® ''Clear'' is a homogenous, ready-to-use, odourless mixture made of metal powder, binding agents, solvents and fluxes. It is free of any thixotropic agents, therefore a steady viscosity is guaranteed. This paste has excellent wetting qualities and is also excellent for soldering of difficult solderable surfaces as chem. Ni/Au, chem. Ag or OSP.

  • uncoloured flux residues
  • low flux expansion 
  • excellent wetting on all known surfaces
  • low volatiles fractions 
  • larger cleaning intervals of the reflow oven
  • real no-clean-quality
  • excellent printing quality
  • high stencil time of at least 72 hours
  • flawless soldering results with all common soldering profiles
  • insensitive against environmental influences
  • Viscosity stability even during longer printing pauses

Product properties

Alloy: Sn96,5Ag3,0Cu0,5
Lead free: ja

Delivery form

Content: 0,500 kg
SMD Weichlotpaste ISO-Cream "Clear"

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