SMD soft solder paste ISO-Cream "Clear"

The lead-free SMD-solder paste ISO-Cream^® ''Clear'' is a homogenous, ready-to-use, odourless mixture made of metal powder, binding agents, solvents and fluxes. It is free of any thixotropic agents, therefore a steady viscosity is guaranteed. This paste has excellent wetting qualities and is also excellent for soldering of difficult solderable surfaces as chem. Ni/Au, chem. Ag or OSP.

• uncoloured flux residues
• low flux expansion 
• excellent wetting on all known surfaces
• low volatiles fractions 
• larger cleaning intervals of the reflow oven
• real no-clean-quality
• excellent printing quality
• high stencil time of at least 72 hours
• flawless soldering results with all common soldering profiles
• insensitive against environmental influences
• Viscosity stability even during longer printing pauses