Electronic solder ISO-Tin® Sn100Ni+ Refill
Through dealloying, copper from the assembly contacts and plated printed circuit boards is continiously washed into the solder bath. Thus the copper content quickly increases above 1% and influences therefore the melting temperature of the solder. This in turn leads to a reduced wetting and might have a negative effect on the performance for the selective solder machines in particular. In order to compensate the copper cumulation and gemanium consumption at the same time within the wave and selective machines filled with ISO-Tin® "Sn100Ni+", we recommend FELDER refill solder ISO-Tin® "Sn100Ni+" -REFILL.A regular analysis of the solder bath is therefore unavoidable.
Sn100Ni+ - Refill
Pellets (Kegel 25/20mm)
Karton à 15 kg