Solder wire "Massiv"
Lead-free solid solder wire for the automated supply in selective solder machines. Besides the known advantages of Ni-endowed solder, by adding germanium and silver our alloy achieves improved wetting properties on all common surfaces used in the electronics manufacturing and minimal dross formation compared to all other lead-free solders. A particular advantage is the low melting temperature of 217 - 222°C, which normally is only achieved by SAC-solders with high silver contents between 3 and 4%. Another advantage is the extremly low dealloyinig rate of copper (compared to common SnAgCu alloys up to 5 times lower). The low silver content of 1.2% in "Sn98Ag+" has no negative effect on the corrosiveness to stainless steel parts. Furthermore, this Ag-addition leads to an improvement of the metal structure of the solder joint compared to SnCuNi-alloys.
Diameter: 2,000 mm