Lead-free solid solder wire for the automated supply in selective solder machines. Besides the known advantages of Ni-endowed solder, by adding germanium and silver our alloy achieves improved wetting properties on all common surfaces used in the electronics manufacturing and minimal dross formation compared to all other lead-free solders. A particular advantage is the low melting temperature of 217°C. Furthermore, this Ag-addition leads to an improvement of the metal structure of the solder joint compared to SnCuNi-alloys. Another advantage FELDER - ISO-Tin® - LEAD-FREE"Sn96Ag+" is the extremly low dealloyinig rate of copper (compared to common SnAgCu alloys up to 5 times lower). Particularly, temperature-sensitive components and circuit boards preferebly require low solder temperatures ≤ 260°C, which cannot be reached with conventional SnCu-solders.
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