Lead-free solid solder wire for the automated supply in selective solder machines. Besides the known advantages of Ni-endowed solder, by adding germanium and silver our alloy achieves improved wetting properties on all common surfaces used in the electronics manufacturing and minimal dross formation compared to all other lead-free solders. A particular advantage is the low melting temperature of 217 - 222°C, which is normally achieved only by SAC-solders with high silver contents between of 3 and 4%. Another advantage is the extremly low dealloyinig rate of copper (compared to common SnAgCu alloys up to 5 times lower). The low silver addition of 1.2% in "Sn98Ag+" has no negative effect on the corrosiveness to stainless steel. Furthermore, this Ag-addition leads to an improvement of the metal structure of the solder joint compared to SnCuNi-alloys
Go back
